4 Layer Blue Solder Mask FR4 Printed Circuit Board

PCB Specifications:

Layer Count: 4 Layer PCB
Material: FR4, TG150
Board Thickness: 1.6MM
Min Hole: 0.3MM
Hole Stucture: L1-L4
Min Trace: 6/6Mil
Unit Size: 175MM*164MM
Solder Mas:Blue
Surface Treatment: OSP
Application: Speaker

Capabilities:

FAQ:

Quesion: What is Organic Solderability Preservative (OSP) or Anti-Tarnish Surface Finish?
Answer: The overall functionality of a PCB board depends upon the conductivity of copper tracks. These tracks tend to oxidize when exposed to the atmosphere, which creates a problem when soldering components on the board. Organic Solderability Preservative (OSP) regulates two things; temporary protection of exposed copper from being oxidized and improving the solderability before component fixation (assembly).
OSP is a very thin (100-4000 Angstroms) organic coating on the PCB board, which is a water-based chemical compound of the ‘Azole family’ such as benzotriazoles, imidazoles, and benzimidazoles. This compound gets absorbed by the exposed copper and generates a protected film.
Advantages of Organic Solderability Preservative:

• Low cost
• Environment-friendly
• Re-workable, but can’t take more than 2-5 rounds of reflow soldering before degradation
• It is lead-free and can handle SMT components easily
• Provides a coplanar surface, well suited for tight-pitch pads (BGA, QFP).

Disadvantages of Organic Solderability Preservative:

• Not Good for PTH (Plated Through Holes)
• Short Shelf Life, less than 6 month
• Inspection is difficult as it is transparent and colorless
• requires careful handling, as it’s susceptible to mechanical damage

OSP Surface Finishing Process:
The OSP finishing process is composed of three major steps that include pre-cleaning and making the PCB board ready to apply a smooth OSP coating:

1. Clean: Organic contaminants such as oil, fingerprints, oxidation film etc. are removed to get a clean PCB board.
2. Topography Enhancement: To improve the bonding forces between exposed copper and OSP film, micro-etching is performed to minimize the oxidation generated on copper.
3. Deionization Rinse: Before the final OSP application, the OSP solution is populated by ions so that it can be eliminated easily during soldering.

Witgain Technology Ltd was established in 2007 in ShenZhen City. After over 10 years development, the company now posses two factories. One factory located in HuiZhou City which is near to ShenZhen. The other one locates in JiangXi Province. Marketing dept still locates in ShenZhen City.

We have about 300 employees in two factories and the monthly output is around 30000m2. Our marketing orientation is to make high difficult and special treatment pcb. Even though, we still accept normal 2-layer and multi-layer pcb orders. Our products cover simple double layer pcb, multi-layer pcb, HDI pcb, rigid-flex pcb, fpc, ceramic pcb, heavy gold/copper pcb etc. Wide product ranges and flexible order quantities allow us to satisfy most customer's demands. 

Quality and technology is what we value most and we will never stop improving our capabilities. Our customer's satisfication is always what we are seeking for.